To efficiently dispose an ink chamber and a plurality of fluid resistance portions in a high density by forming the chamber and the resistance portions of a silicon substrate having a crystal orientation (110), and obliquely setting an arranging direction of the resistance portions with respect to a longitudinal direction of the chamber.

The ink jet head comprises a liquid chamber substrate 1, an electrode substrate 2, and a nozzle plate 4 provided at an upper side of the substrate 1. A plurality of nozzle 5, ink chambers 6 and a common ink chamber 8 or the like are formed. On the substrate 1 are formed the chambers 6, a recess for forming a diaphragm 10 forming its bottom, a groove for forming a fluid resistance portion 7, and a recess for forming the chamber 8. In this case, as the substrate 1, a silicon substrate having a substrate surface in plane (110) that is in plane (111) or particularly a crystal orientation (110) perpendicularly crossing with a direction in plane (112) is used. Thus, a wall structure perpendicular to the surface of the substrate 1 can be formed by anisotropically etching with an alkali liquid.