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Patent Searching and Data


Title:
INLINE SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JPH0517876
Kind Code:
A
Abstract:

PURPOSE: To obtain films free from dust pickup by constituting the above device it such a manner that the soaring up of dust is lessened and clean gases come into contact with substrates in the case of evacuation of chambers 1 to a vacuum from the atm. pressure or conversely in the case of the restoration of the atm. pressure from the vacuum.

CONSTITUTION: This inline sputtering device is constituted by providing discharge holes 8 in the parts of the chambers 1 facing the margin parts leaving the parts of trays 3 to be imposed with the substrates 4 of the loading chamber and unloading chambers of the device and providing vent ports 9 to the parts of the chambers 1 facing the substrates 4.


Inventors:
ICHIKAWA YOSHIHARU
Application Number:
JP17153091A
Publication Date:
January 26, 1993
Filing Date:
July 12, 1991
Export Citation:
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Assignee:
NEC CORP
International Classes:
C23C14/34; C23C14/56; (IPC1-7): C23C14/34; C23C14/56
Attorney, Agent or Firm:
Uchihara Shin