PURPOSE: To enable the insertion height of a lead type electronic component to the circuit board to be set at a specified height, by engaging a bend of a lead molded into a specified shape with the tip of the circuit board to insert leads.

CONSTITUTION: An insertion unit S leaded with an electronic component 2 from lead molder Q is moved downward of arrow Z to insert the component 2 into the circuit board and is moved upward of arrow Z by opening the clamper and the insertion guide, thus returning to an action start position. The electronic component 2 can get the insertion height to the circuit board 5 set at a specified height by engagement of the bend of leads 4, 4 molded non-linearly with the top of the insertion circuit board 5. Since the electronic component 2 can be supplied at a specified height with respect to molding levers 61, 61, the molding positions of the leads 4, 4 can be changed with the supply height, and the leads 4, 4 can be molded at a specified position. As a result, the insertion height of the electronic component 2 into the circuit board 5 can be set at a specified height.