Title:
インソール及びこれを含む靴
Document Type and Number:
Japanese Patent JP7424767
Kind Code:
B2
Abstract:
An insole (13) includes an insole body (131) in a shape receivable in a shoe (1); an electronic element (133) provided in the insole body (131); a connection line (134) configured to electrically connect to the electronic element (133) and including a contact terminal (134a) exposed to the outside of the insole body (131); and a connector (135) including a detachable member (1352) configured to at least partially protrude outward from the insole body (131) and configured to support the contact terminal (134a).
Inventors:
Roh Shikun
安 惠▲うく▼
Changhyun Roh
朴 美▲きょん▼
▲ぺ▼ 藝智
Yongsuke Shen
Choi Min-ho
Byeong-hyun Choi
安 惠▲うく▼
Changhyun Roh
朴 美▲きょん▼
▲ぺ▼ 藝智
Yongsuke Shen
Choi Min-ho
Byeong-hyun Choi
Application Number:
JP2019142152A
Publication Date:
January 30, 2024
Filing Date:
August 01, 2019
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
A43B3/44; A43B13/14; A43B17/00
Domestic Patent References:
| JP2015512674A | ||||
| JP2011524207A | ||||
| JP2006521879A | ||||
| JP1146501A |
Foreign References:
| US4647918 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Ohnuki
Tadahiko Ito
Shinsuke Ohnuki