Title:
INSPECTING APPARATUS FOR PRINTED STATE OF SOLDER PASTE
Document Type and Number:
Japanese Patent JPH04212005
Kind Code:
A
Abstract:
PURPOSE:To rapidly and securely inspect a printed state of solder paste by applying light to a printed board to detect height of its reflecting surface and comparing it with reference data. CONSTITUTION:An picture signal output from a CCD camera 3 is converted into a digital signal and sent to an image memory 8 via a distributor 7 then to be stored. The distributor 7 sequentially stores picture signals having different fringe patterns sent from the camera 3 for each inspection area in each region of a memory 8. Then the picture signals stored in the memory 8 are sent to a computer device 5 where the signals are subjected to image processing, whereby height of each part in the inspection area is detected and also data such as printed area of solder paste 10a swelling from a surface of a printed board 10 is calculated based on the detection so that whether the printed state of the paste 10a is good or not is identified by comparing the data with reference data stored in advance.
Inventors:
SHIGEYAMA YOSHITAKE
KAKIMORI NOBUAKI
YAMAMOTO YUICHI
IWATA YUTAKA
KISHIMOTO MAKOTO
KAKIMORI NOBUAKI
YAMAMOTO YUICHI
IWATA YUTAKA
KISHIMOTO MAKOTO
Application Number:
JP28146490A
Publication Date:
August 03, 1992
Filing Date:
October 18, 1990
Export Citation:
Assignee:
SHARP KK
International Classes:
G01B11/24; G01N21/88; G01N21/93; G01N21/956; G06T1/00; H04N7/18; H05K3/12; H05K3/34; (IPC1-7): G01B11/24; G01N21/88; G06F15/62; H04N7/18; H05K3/12; H05K3/34
Attorney, Agent or Firm:
Shusaku Yamamoto