PURPOSE: To prevent deformation of an external lead of a surface-mounting type IC, enable a positive electrical contact to be maintained for a long time, and further eliminate the need for purchasing or replacing an IC socket which is a conductive member by adopting a connector consisting of an anisotropic conductive rubber plate where a number of metal fine wires are buried, etc.
CONSTITUTION: A positioning tool 5 for guiding an above IC1, a circuit substrate 9 with a pattern 10 corresponding to a placement of an external lead 2 of the IC1, and a connector which is included between the above positioning tool 5 and the circuit substrate 9 and consists of an anisotropic conductive rubber plate 3 where a number of metal thin wires 4 are buried are provided at a conductive part of an electrical characteristic measuring part of an inspection device of the surface-mounting type IC1. For example, the IC1 which is guided by the positioning tool 5 is supplied and mounted to a conductive part which is installed while the anisotropic conductive rubber plate 3 is sandwiched between the printed-circuit board 9 and the positioning tool 5. Then, when a lead press tool 7 is lowered and then the external lead 2 of the IC1 is pressed by an insulation press chip 8, the external lead 2 and the print pattern 10 are allowed to conduct according to the metal thin wire 4 of the anisotropic conductive rubber plate 3.
Next Patent: SEMICONDUCTOR WAFER AND INSPECTING METHOD FOR SEMICONDUCTOR ELEMENT THEREOF