Title:
INSPECTION DEVICE OF PRINTED WIRING BOARD AND ITS INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2003172756
Kind Code:
A
Abstract:
To provide an inspection device of a printed wiring board and its inspection method capable of measuring a characteristic impedance of the printed wiring board in a circuit area of a mounted article.
In this inspection device 1, the impedance of the printed wiring board 30 having plural conductive patterns (the second layer and the fifth layer) formed thereon exerting an influence on a wiring pattern (the third layer) to be measured is inspected. The device is characterized by having pins 2-4 to be brought into contact with the wiring pattern to be measured and the plural conductive patterns, and being equipped with a means for equalizing potentials of the plural conductive patterns.
Inventors:
HAPPOYA AKIHIKO
Application Number:
JP2001376614A
Publication Date:
June 20, 2003
Filing Date:
December 11, 2001
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G01R1/06; G01R27/02; G01R31/02; H05K3/00; (IPC1-7): G01R31/02; G01R1/06; G01R27/02; H05K3/00
Attorney, Agent or Firm:
Togawa Hideaki