To provide an inspection method and an inspection device for a chip component capable of detecting abnormality of a curved part R in the chip component.
This inspection device 2 for the chip component 1 is provided with a binarization image processing part 7, an abnormality detecting part 8 and a monitor 11. The binarization image processing part 7 binarization-processes an image signal of the chip component 1 to discriminate a difference between brightness of the curved part R in an outer peripheral edge of the chip component 1 serving as an inspection object, and brightness of a plane in the periphery of the curved part R. The abnormality detecting part 8 is provided with an inspection area setting part 14 for setting an inspection area in an image area corresponding to a position where the curved part R exists, a curved part brightness area recognizing part 15 for recognizing successive curved part brightness areas binarization-processed in response to the brightness of the curved part R, within the inspection area, a gap calculating part 16 for calculating a gap length existing between the fellow adjacent curved part brightness areas, and a threshold value determining part 17 for determining whether the gap length exceeds a prescribed threshold value or not.
TAKESHIMA NAOKI
SASAKI MUTSUO
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Shiro Terasaki
Hiroaki Aoki
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