INSPECTION METHOD FOR HEIGHT AND POSITION OF BALL OF BALL GRID ARRAY OR BUMP OF FLIP CHIP

Title:

INSPECTION METHOD FOR HEIGHT AND POSITION OF BALL OF BALL GRID ARRAY OR BUMP OF FLIP CHIP

Document Type and Number:

Japanese Patent JPH1068609

Kind Code:

A

Abstract:

To provide an inspection method in which the height and the position of tops of many balls or many bumps of a BGA or a flip chip are measured at extremely high speed and with high accuracy.

A reflection means (a prism 3) for an image is arranged on the side face of the ball 2 of a BGA 1 or the bump of a flip chip, the image on the side face of the ball 2 of the BGA 1 or the bump of the flip chip by the reflection means is input to a measuring means 4, the image is computed and processed by a computing device 5 while a virtual plane 10 and a reference line 11 on the virtual plane 10 are used as references, irregularities in the height and the position of the top of the ball 2 or the bump are detected, and whether the height and the position are good or not is judged.

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Inventors:

MITSUGI SHIGERU
SUGAWARA MASAFUMI
CHIYOUKAI KOUSOU

Application Number:

JP24710096A

Publication Date:

March 10, 1998

Filing Date:

August 28, 1996

Export Citation:

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Assignee:

KUMAMOTO TECHNOPOLIS FOUND
TAIYO MFG
MARUSHIN & CO LTD

International Classes:

G01B11/00; G01B11/02; G01B11/24; H01L21/60; H01L21/66; H01L23/12; H01L21/321; (IPC1-7): G01B11/02; G01B11/00; G01B11/24; H01L21/60; H01L21/66; H01L23/12

Attorney, Agent or Firm:

Fujimori Michio

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