Title:
半導体装置の検査方法
Document Type and Number:
Japanese Patent JP5678511
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device that allows defective portions to be easily identified, to provide a method of forming the same, and to provide a method of designing the same.SOLUTION: A semiconductor device comprises a wiring pattern 32a, a dummy pattern 32b, and a fuse 32c in which a first end is electrically connected to the wiring pattern and a second end is electrically connected to the dummy pattern.
Inventors:
岡田 朋之
Application Number:
JP2010175387A
Publication Date:
March 04, 2015
Filing Date:
August 04, 2010
Export Citation:
Assignee:
富士通セミコンダクター株式会社
International Classes:
H01L21/822; G01R31/28; H01L21/3205; H01L21/66; H01L21/768; H01L21/82; H01L23/522; H01L27/04
Attorney, Agent or Firm:
Kitano Yoshito
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