To provide an inspection pad which enables a substrate to be easily diced.
Two or more circuit regions 2, a first scribe line 3, a second scribe line 4, and inspection pads 5n (n=1, 2, 3, ...) are formed on a substrate 1. The inspection pads 5n are used for inspecting the characteristics of the substrate 1 and formed on the first scribe line 3 at a prescribed interval. A dividing groove 5nc in parallel with the first scribe line 3 is provided at the center of each inspection pad 5n, so that the inspection pad 5n is divided into the inspection pads 5na and 5nb by the dividing groove 5nc. The width of the dividing groove 5nc is set smaller than the diameter of an inspection probe 7n so as to prevent the inspection probe 7n electrically connected to the inspection pad 5n from entering the dividing groove 5nc when an inspection process is carried out.
Keishin Terayama
Hiroyuki Miyoshi
Ichitaro Ito
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