INSULATING COMPOSITION AND INSULATING SHEET CONTAINING THE SAME

Japanese Patent JP2010018679

A

To provide an insulating composition which is comparatively easily handled upon molding and has high adhesiveness to a metal such as copper and high heat conductivity.

The insulating composition is a mixture of a liquid crystalline polymer and a thermosetting resin, a liquid crystalline polymer phase formed of the liquid crystalline polymer and a thermosetting resin phase formed of the thermosetting resin are separated and the liquid crystalline polymer phase forms a continuous phase. The liquid crystalline polymer preferably includes a liquid crystal skeleton of phenyl benzoate, biphenyl, stilbene, diazobenzene, benzylidene aniline or the like and the thermosetting resin is preferably an epoxy resin.

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MIMURA KENJI
NOBUTOKI EIJI
KAKIMOTO MASAAKI
URUSHIBATA HIROAKI
HAYAKAWA TERUAKI
MAEDA RINA

JP2008179258A

January 28, 2010

July 09, 2008

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MITSUBISHI ELECTRIC CORP
TOKYO INST TECH

C08L101/12; C08J5/18; C08K3/00; C08L53/00; C08L63/00; H01B3/30; H01B17/56

JPH0240345A	1990-02-09
JPH11323162A	1999-11-26
JP2003002927A	2003-01-08
JP2007332196A	2007-12-27
JP2007254724A	2007-10-04
JP2007254724A	2007-10-04
JPH0240345A	1990-02-09
JPH11323162A	1999-11-26
JP2003002927A	2003-01-08
JP2007332196A	2007-12-27

Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku
Shunichi Ueda

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