PURPOSE: To reduce the possibilities that an IC element in the IC card is broken and brought to an unusable state caused by electrostatic charges emitted from the human body when the IC card is carried by electrically connecting a section between contact terminals in a semiconductive manner by a semiconductive circuit substrate and dispersing flowing-in charges in the circuit substrate.
CONSTITUTION: A plurality of the contact terminals 3∼6 used for electrically connecting with an external device such as a data transmitter are fitted to the outer surface of the circuit substrate 2 while circuit patterns 8, 9 for bonding the IC element 7 buried on the inner surface side of the circuit substrate 2 are set up, and both the contact terminals 3, 4 and the circuit pattern 8 and both the contact terminals 5, 6 and circuit pattern 9 are each connected through holes 10, 11. Consequently, the contact terminals 3∼6 are connected mutually by resistors R1∼R6, and electrostatic charges applied are dispersed by the semiconductive characteristics of the resistors. Accordingly, when electrostatic charges are applied between arbitrary two terminals 3∼6, they are dispersed in the semiconductive circuit substrate 2 (R1∼R6), and the partial concentration of electrostatic charges to the IC element 7 being buried can be prevented.
OKADA KOUICHI
JIYOU TERUAKI
| JPS5811197A | 1983-01-21 |