Title:
拡張式熱表面に対する統合されたコンパクトな衝当
Document Type and Number:
Japanese Patent JP6628980
Kind Code:
B2
Abstract:
A thermal management system (56) that provides cooling to an electronic device (54) is disclosed. The thermal management system includes a surface (58) having a plurality of extended elements (62) thermally coupled to the surface, a plurality of vibrator assemblies (10) configured to generate a cooling flow across the surface, and a mounting structure (68) disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angle (70), such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle.
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Inventors:
Gamal Refy-Ahmed
Hendrick Peter Jacobs De Bock
Jogen Vishwas Uttarkar
Matthew A. Ferguson
Brian Patrick Wehlen
Christian M. Giovanniello
Hendrick Peter Jacobs De Bock
Jogen Vishwas Uttarkar
Matthew A. Ferguson
Brian Patrick Wehlen
Christian M. Giovanniello
Application Number:
JP2015098659A
Publication Date:
January 15, 2020
Filing Date:
May 14, 2015
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
H05K7/20; H01L23/473
Domestic Patent References:
| JP201067910A | ||||
| JP2010245539A | ||||
| JP2012521641A |
Foreign References:
| US20070037506 |
Attorney, Agent or Firm:
Kazuya Sekiguchi
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka