Title:
JOINING DEVICE AND JOINING METHOD
Document Type and Number:
Japanese Patent JP2022082007
Kind Code:
A
Abstract:
To provide a technique for reducing distortion between substrates which occurs after joining warped substrates.SOLUTION: A joining device joins the joining surface of a first substrate and the joining surface of a second substrate so as to face each other, and manufactures a polymerized substrate including the first substrate and the second substrate. The joining device includes a first holding unit, a second holding unit, a pushing unit, a temperature control unit, and a control unit. The first holding unit holds the first substrate from above. The second holding unit holds the second substrate from below. The pushing unit pushes down the center of the first substrate arranged at a distance from the second substrate and brings it into contact with the second substrate. The temperature control unit adjusts the temperature distribution of the first substrate or the second substrate before joining. The control unit controls the temperature control unit on the basis of at least one of the warpage of the first substrate and the second substrate before joining and the strain generated between the first substrate and the second substrate after joining.SELECTED DRAWING: Figure 13
Inventors:
WADA NORIO
MANABE EIJI
MANABE EIJI
Application Number:
JP2020193289A
Publication Date:
June 01, 2022
Filing Date:
November 20, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/02; H01L21/683
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito