Title:
JOINING METHOD OF SILICON AND SILICON JOINED BODY
Document Type and Number:
Japanese Patent JP3932644
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for joining a silicon material on an insulation substrate without using an adhesive.
SOLUTION: A plating layer 2 is formed on an etched surface of an insulating substrate 1. The plating layer 2 is formed by electroplating or electroless plating. The surface of the plating layer 2 is subjected to a specular grinding processing and a gold plating layer 3 is formed on the ground surface. A silicon material 4 is disposed at a prescribed position on the gold plating layer 3, and heated and pressed at 400-600°C so as to be fixed and joined by mutual diffusion of the silicon and the gold.
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Inventors:
Yasushi Kobayashi
Application Number:
JP1721198A
Publication Date:
June 20, 2007
Filing Date:
January 29, 1998
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
B32B7/12; C04B37/00; (IPC1-7): C04B37/00; //B32B7/12
Domestic Patent References:
| JP8040789A | ||||
| JP52082369U |
Attorney, Agent or Firm:
Yasuo Ishikawa
Tatsuo Egami
Koji Yamamoto
Tatsuo Egami
Koji Yamamoto
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