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Patent Searching and Data


Title:
LAMINATE FILM FOR HEAT-SHRINK PACKAGING
Document Type and Number:
Japanese Patent JPH04173135
Kind Code:
A
Abstract:

PURPOSE: To improve heat shrinkability and prevent matter to be packed from fusing with the film concerned by a structure wherein surface layer consisting of mixture of high-pressure-processed polyethylene resin or specified ethylene- vinyl compound copolymer resin and propylene-ethylene copolymer resin is laminated on both sides of intermediate layer made of high-pressure-processed polyethylene resin or ethylene-vinyl acetate copolymer resin.

CONSTITUTION: Surface layer consisting of mixture of high-pressure-processed polyethylene resin or 70-85wt.% of ethylene-vinyl compound copolymer resin containing 20wt.% or less of vinyl compound and 30-15wt.% or propylene- ethylene copolymer resin is laminated on both sides of intermediate layer made of high-pressure-processed polyethylene resin or ethylene-vinyl acetate copolymer resin containing 20wt.% or less of vinyl acetate. As the ethylene-vinyl compound copolymer resin, ethylene-acrylic acid copolymer, ethylene-ethyl acrylate copolymer or the like is used including ethylene-vinyl acetate copolymer.


Inventors:
KAWASE MIKIO
MIYAZAKI OSAO
Application Number:
JP29849690A
Publication Date:
June 19, 1992
Filing Date:
November 02, 1990
Export Citation:
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Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
B65D65/40; B32B7/02; B32B27/28; B32B27/32; (IPC1-7): B32B7/02; B32B27/28; B32B27/32; B65D65/40
Attorney, Agent or Firm:
Hasegawa Hajime (1 person outside)