Title:
LAMINATE FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2021054012
Kind Code:
A
Abstract:
To provide a laminate for printed wiring board which is excellent in productivity, allows a base material and a metal foil to be strongly bonded to each other, and can cope with a five-generation mobile communication system using a high frequency band.SOLUTION: A laminate 10 for printed wiring board has a base material 1 containing a thermoplastic resin, a modified layer 2 positioned on one surface side of the base material, an adhesive layer 3 that is positioned on a surface side opposite to the base material of the modified layer and contains a thermosetting resin, and a metal foil layer 4 positioned on a surface side opposite to the modified layer of the adhesive layer.SELECTED DRAWING: Figure 1
Inventors:
YOSHIMI SEIICHI
Application Number:
JP2019181520A
Publication Date:
April 08, 2021
Filing Date:
October 01, 2019
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B32B15/08; B32B7/025; H05K1/03
Attorney, Agent or Firm:
Akihiko Yamashita
Kishimoto Tatsuto
Kishimoto Tatsuto