Title:
LAMINATE STRUCTURE FOR HIGH FREQUENCY SIGNAL TRANSMISSION, AND HIGH FREQUENCY SIGNAL SEMICONDUCTOR PACKAGE USING THE SAME
Document Type and Number:
Japanese Patent JP3924527
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laminate structure for high frequency signal transmission wherein a usable frequency band is widened by moving the resonance frequency to the high frequency signal side, and also to provide a high frequency signal semiconductor package using the same.
SOLUTION: Signal wiring conductors which are formed respectively in the uppermost and the lowest layers of a laminate substrate made by stacking four or more dielectric layers are extended in opposite directions from one end.One end of each signal wiring conductor and a through conductor which is extended up and down through the dielectric layer in the uppermost and the lowest layers are connected via a signal wiring connection conductor. In each layer of a lining except for the uppermost and the lowest layers, a lining earth conductor non-formation region which has a plane shape of a biaxisymmetric profile and a lining earth conductor are formed. The lining earth conductor non-formation region formed in the intermediate layer among those which constitute the lining is formed in a narrower region than in the other layers.
Inventors:
Takehiro Okudo
Application Number:
JP2002346579A
Publication Date:
June 06, 2007
Filing Date:
November 28, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; (IPC1-7): H01L23/12
Domestic Patent References:
| JP6163739A | ||||
| JP6085104A | ||||
| JP6021253A | ||||
| JP7240483A | ||||
| JP6088099A |
Previous Patent: METHOD FOR MANUFACTURING BIAXIALLY ORIENTED POLYIMIDE FILM
Next Patent: COMBINE HARVESTER
Next Patent: COMBINE HARVESTER