Title:
LAMINATE-TYPE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023099412
Kind Code:
A
Abstract:
To prevent a hydrogen gas generated in a plating process from going into a chip to prevent the degradation of a dielectric layer in insulation resistance.SOLUTION: A laminate-type electronic component 100 comprises: a main body 110 including dielectric layers 111 and internal electrodes 121, 122; and external electrodes 131, 132 disposed on the main body 110 and connected to the internal electrodes 121, 122. The external electrodes 131, 132 include: first electrode layers 131a, 132a disposed on the main body 110 and containing Cu and glass; second electrode layers 131b, 132b disposed on the first electrode layers 131a, 132a and containing Ni and Cu; and third electrode layers 131c, 132c disposed on the second electrode layers 131b, 132b and containing Ni and glass.SELECTED DRAWING: Figure 2
Inventors:
KIM HYE WON
OH WONG-KUEN
LEE CHAE DONG
KIM OG SOON
PARK JOONG WON
OH WONG-KUEN
LEE CHAE DONG
KIM OG SOON
PARK JOONG WON
Application Number:
JP2022063596A
Publication Date:
July 13, 2023
Filing Date:
April 06, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G4/30
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office