Title:
LAMINATED BOARD FOR PRINTED CIRCUIT
Document Type and Number:
Japanese Patent JPH04243186
Kind Code:
A
Abstract:
PURPOSE: To obtain a laminated board for a printed circuit having excellent heat resistance and workability.
CONSTITUTION: In a laminated board for a printed circuit of a composite structure in which a glass cloth is arranged on a surface layer and nonwoven fabric is arranged on an intermediate layer, a base material of the surface layer and/or a core layer is impregnated with radical curable unsaturated resin mixed with boehmite type aluminum hydroxide, and then, thermally cured to manufacture the laminated board.
Inventors:
MINAMIMURA KIYOYUKI
IMASHO KEIJI
IMASHO KEIJI
Application Number:
JP1836991A
Publication Date:
August 31, 1992
Filing Date:
January 17, 1991
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
B32B15/08; H05K1/03; (IPC1-7): B32B15/08; H05K1/03
Attorney, Agent or Firm:
Akaoka Mio