Title:
積層体、電子デバイスの製造方法、積層体の製造方法
Document Type and Number:
Japanese Patent JP7303963
Kind Code:
B2
Abstract:
The present invention provides a laminate that can eliminate adsorption defects of a substrate caused by warping of the substrate and enables electronic devices to be manufactured at high yield. The present invention pertains to a laminate that is provided with a support base material, an adhesion layer, and a substrate in said order. The substrate is provided with a dielectric multilayer film in which dielectric layers having different refractive indexes are alternately laminated on an outer surface of the substrate. The substrate provided with the dielectric multilayer film is disposed on the adhesion layer such that the dielectric multilayer film adheres in a peelable manner to the adhesion layer.
Inventors:
Tatsuzo Miyakoshi
Akio Fujiwara
Akio Fujiwara
Application Number:
JP2021146731A
Publication Date:
July 06, 2023
Filing Date:
September 09, 2021
Export Citation:
Assignee:
AGC Inc.
International Classes:
B32B7/06
Domestic Patent References:
| JP2003007499A | ||||
| JP9219356A | ||||
| JP2011131149A | ||||
| JP2015012069A | ||||
| JP2011230944A |
Foreign References:
| WO2012144499A1 |
Attorney, Agent or Firm:
Hideaki Ito
Hirohisa Hachiya
Fumio Mihashi
Hiroshi Uenishi
Hirohisa Hachiya
Fumio Mihashi
Hiroshi Uenishi