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Title:
LAMINATED COMPOSITE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2000331838
Kind Code:
A
Abstract:

To provide a laminated composite electronic component which is kept free from warpage and inner cracking, restrained from deteriorating in insulation resistance at a lamination interface between an inductor and a capacitor, high in moisture resistance, and excellent in load reliability.

A laminated composite electronic component is a three-layered structure such as an LCL structure or a CLC structure composed of a laminate of certain material and two laminates of the same material provided by sandwiching the former laminate between them. One of the two outer laminates is formed of the same material with the middle laminate, and the laminated composite electronic component is of an LC or a CL structure. The grounding electrode of the capacitor 14 is provided only on the side of the dielectric layer of the burned laminate corresponding to the capacitor 14.


Inventors:
HOSHI KENICHI
KAMIYAMA YOSHIAKI
HORII TAKESHI
YATABE MASUO
IRISAWA YUTAKA
SUGIHARA TAKASHI
Application Number:
JP13800799A
Publication Date:
November 30, 2000
Filing Date:
May 19, 1999
Export Citation:
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Assignee:
TAIYO YUDEN KK
International Classes:
H01F17/00; H01F27/00; H01G4/40; (IPC1-7): H01F27/00; H01F17/00; H01G4/40
Attorney, Agent or Firm:
Tadashi Sano



 
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