Title:
LAMINATED FILM FOR HEAT SEALING
Document Type and Number:
Japanese Patent JP3238582
Kind Code:
B2
Abstract:
PURPOSE: To use a film for a cover material of a packaging vessel for an IC, an electronic component, etc., such as a packaging vessel, etc., for baking by laminating an adhesive layer made of resin composition and a support layer made of the same composition as the adhesive layer or olefin resin by coextrusion molding.
CONSTITUTION: A laminating film for heat sealing is obtained by laminating an adhesive layer D made of resin composition A, a support layer E made of resin composition B or olefin resin C by coextrusion molding. The composition A contains a pts.wt. of polyphenylene ether resin, b pts.wt. of polystyrene resin and c pts.wt. of thermoplastic elastomer in such a manner that the a, b and c are the resin compositions for satisfying following formula 1. The composition B contains d pts.wt. of polyphenylene ether resin, e pts.wt. of polystyrene resin and f pts.wt. of thermoplastic elastomer in such a manner that the d, e, f are resin composition s for satisfying a formula 2. The olefin resin C is used.
Inventors:
Tetsuo Fujimura
Masami Inoue
Tadaaki Hirooka
Masami Inoue
Tadaaki Hirooka
Application Number:
JP26558894A
Publication Date:
December 17, 2001
Filing Date:
October 28, 1994
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
B32B25/08; B32B27/00; B32B27/30; B32B27/32; C08L71/00; C08L71/12; (IPC1-7): B32B27/00; B32B27/30
Domestic Patent References:
| JP6248121A |