PURPOSE: To provide a layered integrated circuit element of high reliability wherein the whole shape can be miniaturized and thinned and damage is hardly caused by external force.

CONSTITUTION: A layered integrated circuit element 1 has a thin film circuit part 3 wherein a resistor and an active element are formed on a substrate 2 as a specified connection structure by using a thin film, and a thick circuit part 4 wherein a capacitive element having a specified connection structure is formed by using a thick film and laminated on the thin film formed surface side of the substrate 2. By the effect of the structure, an IC chip used in the conventional art is made unnecessary, the whole shape can be miniaturized and thinned, each circuit element hardly suffers damage by external force, and reliability can be improved.