Title:
積層メタマテリアル基板
Document Type and Number:
Japanese Patent JP6379009
Kind Code:
B2
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Inventors:
Daisuke Kuruyama
Song Ho Jin
Yaita Shin
Song Ho Jin
Yaita Shin
Application Number:
JP2014222395A
Publication Date:
August 22, 2018
Filing Date:
October 31, 2014
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H01Q15/02
Domestic Patent References:
| JP2005210016A |
Foreign References:
| US20100220035 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Rie Kudo
Rie Kudo