Title:
積層造形装置
Document Type and Number:
Japanese Patent JP6885978
Kind Code:
B2
Abstract:
To provide a lamination molding device capable of suppressing the slippage of the focal position of a laser during molding.SOLUTION: A lamination molding device comprises: a table to be spread with metal material powder; a recoater head of performing reciprocating in a horizontal uniaxial direction to feed the material powder onto the table, and further flattening the same to form a powder layer; a molding chamber stored with the table and the recoater head and installed with a protective glass attachably/detachably at a ceiling part; a laser irradiation apparatus irradiating the prescribed region of the powder layer with a laser passed through the protective glass to form a sintered layer in which the material powder is sintered; and a protective glass exchange apparatus exchanging the protective glass into a new protective glass during the molding of a molded part made of the sintered layer.SELECTED DRAWING: Figure 1
Inventors:
Miyashita Yasuyuki
Application Number:
JP2019034464A
Publication Date:
June 16, 2021
Filing Date:
February 27, 2019
Export Citation:
Assignee:
Sodick Co., Ltd.
International Classes:
B22F12/90; B22F10/28; B23K26/00; B23K26/046; B23K26/70; B33Y30/00
Domestic Patent References:
| JP2018202485A | ||||
| JP6405028B1 |
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito