To provide a laminated molded product suppressing the lamination failure (peeling) in a laminated molded product composed of two kinds of green sheets using a different kind of materials and improving the reliability of a wiring board, and a laminated part.

The laminated molded product 2 is constituted by laminating a first green sheet 1a containing a first inorganic composition and a first resin and a second green sheet 1b containing a second inorganic composition and a second resin. When the temperature causing the volumetric shrinkage of the green sheets 1 and 2 by 0.3% with respect to the dimensions of them at 25°C at the time of baking and the baking shrinkage start temperature of both green sheets 1 and 2 are defined to T1 and T2 and a change in the length of the green sheet 1 at a specific temperature with respect to 25°C, when the green sheet 1 per a unit length is baked, is defined as a dimensional change ratio and the smaller one of the dimensional change ratios of the first and second green sheets in the temperature region from 25°C to a lower temperature of T1 or T2 is set to SA and the larger one is set to SB, the ratio of SA/SB is always larger than 0.999.