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Title:
積層構造体及びその製造方法
Document Type and Number:
Japanese Patent JP5899668
Kind Code:
B2
Abstract:
Disclosed is a laminate structure including a substrate, a wettability changing layer (12), and an electrical conductor layer (13), wherein the wettability changing layer and the electrical conductor layer are laminated on the substrate (11) in order, wherein the wettability changing layer contains a polyimide, wherein the polyimide is obtainable by dehydrating and ring-opening a polyamic acid, wherein the polyamic acid is obtainable by ring-opening and addition-polymerizing a diamine and a tetracarboxylic acid dianhydride, wherein the diamine includes a compound represented by a general formula of: or a compound represented by a general formula of: , wherein each of R 1 and R 2 in formula (1) is defined in the specification, and wherein R 1 in formula (2) is defined in the specification.

Inventors:
Takanori Tano
Yukie Suzuki
Yusuke Tsuda
Application Number:
JP2011129010A
Publication Date:
April 06, 2016
Filing Date:
June 09, 2011
Export Citation:
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Assignee:
株式会社リコー
International Classes:
B32B27/34; C08G73/10; H01L21/336; H01L29/786; H01L51/05; H01L51/30; H01L51/40
Domestic Patent References:
JP2010270283A
JP11140186A
JP2010241113A
JP2009188259A
JP2008041951A
JP2008227294A
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito



 
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