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Title:
LAP CORRECTION METHOD AND ITS DEVICE
Document Type and Number:
Japanese Patent JPH0819959
Kind Code:
A
Abstract:

PURPOSE: To provide a correction carrier which can easily corrects a partially abraded lap so as to carry out correction machining in a short time in a correcting device for a rotary type plane lapping machine.

CONSTITUTION: A correcting device is provided with a rectangular correction carrier 24, which is long in the radius direction of a lap, and reciprocating devices 7, 9 reciprocated on a plane parallel to the correction face of the lap. The longitudinal directional dimension of the correction carrier 24 is wider than the width in radius direction of the lap 18, while a reciprocating stroke of the correction carrier 24 is the stroke by which the correction carrier 24 does not come off from the correction face for the lap 18. The correction carrier 24 is reciprocated in the radius direction of the lap 18 desirably. In the correction carrier 24, electrodeposition of diamond abrasives 25 is carried out on its abrasive face, in other words, the diamond abrasives 25 are held on the machining face of the correction carrier 24 by means of nickel plating layer 26 and the like.


Inventors:
ISHIKAWA KENICHI
Application Number:
JP17959994A
Publication Date:
January 23, 1996
Filing Date:
July 06, 1994
Export Citation:
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Assignee:
ISHIKAWA KENICHI
FUJIKOSHI MACHINERY CORP
International Classes:
B24B53/017; (IPC1-7): B24B37/00
Attorney, Agent or Firm:
Takao Nishi