PURPOSE: To obtain works in different thicknesses with good productivity by sending processing heads intermittently, controlling the processing conditions of each pressing member with a processing control member, and providing the desired processed condition for each processing head.

CONSTITUTION: In the case of semi-conductor wafer as the work to be processed, a processing head 21 to which a wafer to be processed 48 is supplied, stops in the next position, and a timer 52 is actuated, and advance of an air cylinder 25 sinks the wafer 48 to be pressed by a lapping plate 12 with a certain pressure for performance of processing. If in this condition the preset processing time is out, the timer 52 shuts a solenoid valve 26 to retract the air cylinder 25, and the wafer 48 rises to finish processing, and transported intermittently one after another to stop in the loading position. Thus a plurality of processing heads make processing of a number of works at the same time, and the heads can be provided with individual processing conditions, which will accomplish high productivity, and the processing condition can be selected for each work to be processed.