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Title:
LAPPING MACHINE
Document Type and Number:
Japanese Patent JPS62162464
Kind Code:
A
Abstract:

PURPOSE: To automatically and efficiently obtain a high precision finished surface with no scratch by providing a control mechanism for controlling the rotating speed and pressure to be applied through detecting means for detecting the amount of lapping and the output therefrom.

CONSTITUTION: A cutting tool 18 is advanced by a tool feed mechanism 17 to flatten the surface of a rotating lapping surface plate 2. Then, with a work adhered through suction to the lower surface of a work holder 16, the lapping surface plate 2 is rotated at a low speed, according to the instruction of a control panel 24, abrasive grain liquid being supplied through a hose 27, the work holder 16 rotated and a low pressure applied by a pressure mechanism 21, so as to perform lapping. When a displacement detector 28 detects a predetermined amount of machining, the speed and pressure are changed to a high speed and high pressure, and after a predetermined amount of machining is performed, the speed and pressure is again changed to the low speed and low pressure for further machining. Thus, the amount of machining is detected by the displacement detector 28 and the rotating speed and pressure to be applied are controlled by the control mechanism in such a way that machining is carried out at a low speed under a low pressure at the start and termination of the machining in which scratches are apt to occur, permitting automatic and effective preparation of a fine finished surface with no scratch.


Inventors:
TAMURA TOSHIO
OKU TSUNEO
ARAKAWA NORIYOSHI
Application Number:
JP23286A
Publication Date:
July 18, 1987
Filing Date:
January 07, 1986
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B24B37/07; B24B37/10; B24B49/00; B24B49/16; (IPC1-7): B24B37/04; B24B49/00; B24B49/16
Domestic Patent References:
JPS56146666A1981-11-14
Attorney, Agent or Firm:
Masami Akimoto



 
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