Title:
LAPPING METHOD OF ELECTRONIC PART BOARD
Document Type and Number:
Japanese Patent JPH07285063
Kind Code:
A
Abstract:
PURPOSE: To simplify a work washing process in the lapping work of ceramics and glass boards (work parts).
CONSTITUTION: A work W kept by a carrier 10 is held between both lower and upper surface plates 1 and 2, and this carrier 10 is rotated or revolved, whereby both upper and lower surfaces of this work W are polished. A mixed solution between a polishing fluid inclusive of abrasive grains and a cleaner is stored in a tank 21, and in time of lapping, the mixed solution is fed to a work W through a receiver 24 and a tube 25.
Inventors:
SHIMIZU HIROSHI
Application Number:
JP8117794A
Publication Date:
October 31, 1995
Filing Date:
April 20, 1994
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
B24B37/00; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; H01L21/304
Attorney, Agent or Firm:
Morishita Takeichi