To enhance yield of an element, which is manufactured by using a crystallized thin film, by reducing uneven crystallization while using a currently used pulse laser beam.
In a method whereby a pulse laser beam 1 is allowed to scan a non-single crystal thin film 2 on a substrate 4 and superposed irradiation is performed thereon so as to achieve crystallization, the pulse laser beam 1 is emitted at an angle α of 5 to 85° formed by a major axis direction and the scanning direction of the pulse laser beam 1, and crystallization is carried out. In this case, regarding the pulse laser beam, when a ratio of a major axis diameter and a minor axis diameter is 100 or more, a scanning pitch for each irradiation is d, and an angle is α, d.cosα is 2 μm or more. Further, the pulse laser beam has a space average intensity of 200 to 400 mJ/cm2.
YOSHIOKA TATSUO
KOBAYASHI IKUNORI
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