Title:
LASER BEAM MACHINING DEVICE
Document Type and Number:
Japanese Patent JP3682295
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining device of high productivity capable of performing fine machining with high accuracy.
SOLUTION: The laser beam machining device comprises first scanners (5 and 6) to deflect laser beams (2) from a laser beam oscillator (3), second scanners (7 and 8) to deflect the laser beams passing through the first scanners in an arbitrary travel direction, and a lens (10) to condense the laser beams passing through the second scanners on a work (9) on an XY stage (11). The angle of deflecting the laser beams of the first scanners (5 and 6) is set to be smaller than that of the second scanners (7 and 8).
Inventors:
Masahiko Sakamoto
Shono Takeno
Congratulations Yasuhiko
Hokokan Toshiyuki
Kurosawa Maki
Shono Takeno
Congratulations Yasuhiko
Hokokan Toshiyuki
Kurosawa Maki
Application Number:
JP2004146326A
Publication Date:
August 10, 2005
Filing Date:
May 17, 2004
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K26/082; G02B26/10; (IPC1-7): B23K26/08; G02B26/10
Domestic Patent References:
| JP5318149A | ||||
| JP10109186A | ||||
| JP49096739A | ||||
| JP4305614A | ||||
| JP61187469A |
Foreign References:
| WO2000005336A1 |
Attorney, Agent or Firm:
Aoyama Aoi
Osamu Kawamiya
Osamu Kawamiya