Title:
LASER BEAM MACHINING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2004074253
Kind Code:
A
Abstract:
To provide a laser beam machining method and device that reduce damage to an inner layer copper foil and that enable highly reliable via hole to be machined.
The amount of energy required for completing machining of a workpiece from its arbitrary machined state is preliminarily determined, collected in a data table and stored in a storage section 23. At the time of machining, a machined state of the workpiece 14 is determined from the intensity of a beam 15 reflected on the machining zone, so that the energy of a laser beam 3 to be emitted next is controlled by referring to the data table.
Inventors:
SUGAWARA HIROYUKI
MORI SADAO
AOYAMA HIROSHI
WATANABE HIDEYUKI
GOTO TAKESHI
MORI SADAO
AOYAMA HIROSHI
WATANABE HIDEYUKI
GOTO TAKESHI
Application Number:
JP2002240945A
Publication Date:
March 11, 2004
Filing Date:
August 21, 2002
Export Citation:
Assignee:
HITACHI VIA MECHANICS LTD
International Classes:
B23K26/00; B23K26/382; H05K3/00; (IPC1-7): B23K26/00; H05K3/00
Attorney, Agent or Firm:
Kenjiro Take
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