Title:
LASER BEAM MACHINING MONITORING DEVICE
Document Type and Number:
Japanese Patent JP2000202657
Kind Code:
A
Abstract:
To enable detecting up to a depth without needing strictness in an installation position and becoming large size by only one set of sensor.
In the case that a work 10 is irradiated with laser beam 11 to machine the work 10, in a monitoring device to detect light emitting state of S part to be worked of the work piece, the light emission of the S part of the work piece which goes back to an optical system 15 on which the laser beam 11 is made incident is made to enter into a sensor 17 through a monitoring system 16 in a branched light passage separated from the laser beam 11.
Inventors:
MIYAMOTO ISAMU
ISHIDE TAKASHI
NAYAMA RISUKE
NAGURA YASUMI
HASHIMOTO YOSHIO
OKIMURA KOJI
ISHIDE TAKASHI
NAYAMA RISUKE
NAGURA YASUMI
HASHIMOTO YOSHIO
OKIMURA KOJI
Application Number:
JP737899A
Publication Date:
July 25, 2000
Filing Date:
January 14, 1999
Export Citation:
Assignee:
MIYAMOTO ISAMU
MITSUBISHI HEAVY IND LTD
MITSUBISHI HEAVY IND LTD
International Classes:
B23K26/00; B23K26/03; (IPC1-7): B23K26/00; B23K26/02
Attorney, Agent or Firm:
Toshiro Mitsuishi (2 outside)