PURPOSE: To provide a laser beam redundancy device capable of improving the throughput and the defective cutting.

CONSTITUTION: A laser beam source 103 emits the laser beam 104. A plurality of openings are formed in an aperture 110. An optical system 109 irradiates the laser beam 104 on the aperture 110. The optical system 111 irradiates a plurality of shaped beams which are simultaneously obtained by passing the laser beam through the aperture 110 on a wafer 100 to achieve the cutting. When a fuse is simultaneously irradiated with a plurality of shaped laser beams, the cutting probability is improved. On the other hand, when a plurality of fuses are separately irradiated with the laser beams, the throughput is improved. An aperture mechanism 112 moves the aperture 110 in the horizontal direction to the aperture plane, and select a plurality of openings formed in the aperture 110 through which the laser beam passes.