Title:
レーザ加工装置、レーザ加工条件設定装置、レーザ加工方法、レーザ加工条件設定方法、レーザ加工条件設定プログラム
Document Type and Number:
Japanese Patent JP5072281
Kind Code:
B2
Inventors:
Kotaro Morizono
Hideki Yamakawa
Hiroyasu Hasebe
Hideki Yamakawa
Hiroyasu Hasebe
Application Number:
JP2006206052A
Publication Date:
November 14, 2012
Filing Date:
July 28, 2006
Export Citation:
Assignee:
Keyence Corporation
International Classes:
B23K26/00; B23K26/08; G02B26/10
Domestic Patent References:
| JP2000202655A | ||||
| JP2000339011A | ||||
| JP2001068764A | ||||
| JP2004122188A | ||||
| JP2004230443A | ||||
| JP2006150418A |
Attorney, Agent or Firm:
Toshisu Koji
Yasuhiro Toyosu
Yasuhiro Toyosu