Title:
レーザ加工装置およびレーザ加工方法
Document Type and Number:
Japanese Patent JP4633335
Kind Code:
B2
Abstract:
To prevent adhesion of fused substances to the circumference by momentarily vaporizing the fused substances generated at the processing portion of a work.
The apparatus is provided with an XY table 2 for mounting a wafer 1, a drive mechanism 3 for driving the XY table 2, a laser oscillator 6 for irradiating the wafer 1 with a laser beam 5, and a controller 4 for controlling the drive mechanism 3 and the laser oscillator 6. The apparatus is also provided with a liquid drop supplying means 10 for supplying drops 9a of liquid 9 to the processing portion 1a to be irradiated with the laser beam 5 for vaporizing the fused substances of the wafer 1.
COPYRIGHT: (C)2004,JPO&NCIPI
Inventors:
Kunimitsu Takahashi
Koki Shimizu
Satoshi Hotta
Koki Shimizu
Satoshi Hotta
Application Number:
JP2003034199A
Publication Date:
February 16, 2011
Filing Date:
February 12, 2003
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301
Domestic Patent References:
| JP59045092A | ||||
| JP54126647A | ||||
| JP49051697A | ||||
| JP61140396A | ||||
| JP59225896A | ||||
| JP55008497A |
Attorney, Agent or Firm:
Konobu Kato