To provide a laser marking apparatus for a coil spring, which can perform a laser marking on the curved surface of an outer circumferential surface of the coil spring, a coil spring manufacturing apparatus and a coil spring subjected to the laser marking by which the traceability of each coil spring can be enhanced.

The laser marking apparatus 100 for the coil spring holds a coil spring 300 to be fed, detects an area of 90-180 from a wind-terminating end of an end coil portion of the coil spring 300, and determines a plurality of marking parts on both side curved surfaces of an outermost circumferential line of the coil spring 300. Laser beams are applied to the marking parts from a laser beam application unit 103a to perform the laser marking of the depth of 0.05-3% of the diameter of a wire forming the coil spring 300. The coil spring manufacturing apparatus 200 forms the coil spring 300 from a wire 30 to be fed, and cuts the coil spring 300 from a non-formed wire after performing the laser marking similarly to the laser marking apparatus 100 for coil springs.