Title:
レーザー加工装置およびビーム径測定方法
Document Type and Number:
Japanese Patent JP7334072
Kind Code:
B2
Abstract:
To provide a laser processing device which can measure a beam diameter of a laser beam without stopping the device, and to provide a beam diameter measuring method.SOLUTION: A laser processing device includes: a chuck table 10 which holds a workpiece 200; a laser beam radiation unit 20 which radiates a laser beam 21 to the workpiece 200 held by the chuck table 10; a processing feed unit which relatively moves the chuck table 10 and the laser beam radiation unit 20 in a processing feed direction; a control unit which controls the laser beam radiation unit 20 and the processing feed unit; and a mask unit 30 which is disposed at a predetermined position on an optical axis of the laser beam 21, includes a transmission part which transmits the laser beam 21 and a light blocking part which encloses the transmission part and blocks a part of the laser beam, measures a beam diameter of the laser beam 21, and forms a beam shape in a light collection spot of the laser beam 21.SELECTED DRAWING: Figure 3
Inventors:
Yuta Yoshida
Application Number:
JP2019112940A
Publication Date:
August 28, 2023
Filing Date:
June 18, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23K26/066; B23K26/00; B23K26/364; H01L21/301
Domestic Patent References:
| JP2005095936A | ||||
| JP2012155159A | ||||
| JP2006319198A |
Foreign References:
| WO2015029141A1 |
Attorney, Agent or Firm:
Sakai International Patent Office
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