LASER PROCESSING METHOD

Japanese Patent JP2014079794

A

To provide a laser processing method which can prevent damage to a surface of a material to be processed caused by irradiation with a laser beam.

A laser processing method is provided with: a step for preparing a material 1 to be processed; and a step for irradiating the material 1 to be processed with a laser beam. In the step for preparing the material 1 to be processed, a protection film 20 is formed on the surface of the material 1 to be processed. In the step for irradiating with the laser beam, a condensing region is formed by condensing the laser beam in a condenser lens, and the material 1 to be processed is irradiated with the laser beam from a surface side where the protection film 20 is formed in the material 1 to be processed so that at least a part of the condensing region is positioned inside the material 1 to be processed. A second damage threshold corresponding to the power of the laser beam necessary to cause damage to the protection film 20 by the laser beam is smaller than a first damage threshold corresponding to the power of the laser bean necessary to cause damage to the material 1 to be processed by the laser beam.

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NAGANO SHIGEHIRO
KAKUI MOTOKI
OKAMOTO YASUHIRO
OKADA AKIRA

JP2012230593A

May 08, 2014

October 18, 2012

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SUMITOMO ELECTRIC INDUSTRIES

B23K26/18; B23K26/046; B23K26/064; B23K26/382; B23K26/40; B28D5/00; C03B33/09; H01L21/301

JP2004188475A	2004-07-08
JP2009147108A	2009-07-02
JP2006305586A	2006-11-09
JP2007103690A	2007-04-19

WO2012108503A1

2012-08-16

Fukami patent office

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