Title:
LASER DRILLING DEVICE
Document Type and Number:
Japanese Patent JP2017024028
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a drill processing device that, when a drilling process for a work piece is performed by scanning a laser beam, prevents a drilling process from being finished with insufficient drilling and that is able to reduce the zone of a heat affected part around a cut area of the work piece.SOLUTION: A laser drilling device 1 comprises: a laser oscillator 2 that emits a laser beam; a scanner 3 that scans a laser beam; a control device 4 that controls the laser oscillator 2 and the scanner 3; a light-receiving sensor 5 as a detecting part; and a processing device 6. The detecting part detects penetration of a work piece W in a laser-beam emitted place. The control device 4 measures time for which the penetration in the laser-emitted place is continuously detected by the detecting part. When the measured time is equal to or longer than the time required to emit a laser beam Lf one rotation around a hole on the work piece by scanning, the emission of the laser beam Lf for scanning trajectory is terminated.SELECTED DRAWING: Figure 1
Inventors:
UCHIDA YOSHIAKI
OKAZAKI TOMOYA
OKAZAKI TOMOYA
Application Number:
JP2015143091A
Publication Date:
February 02, 2017
Filing Date:
July 17, 2015
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B23K26/382; B23K26/00; B23K26/03
Domestic Patent References:
| JP2015145028A | 2015-08-13 | |||
| JP2007136471A | 2007-06-07 |
Foreign References:
| US5223692A | 1993-06-29 |
Attorney, Agent or Firm:
Ken Ieiri
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