PURPOSE: To shorten operating time and to enable the reduction of manpower by a method wherein a surface packaging process of electronic components provided with leads, which includes such processes as component feed, the formation of component leads, the positioning and the packaging of components onto a printed board, and the soldering of components, is automated.

CONSTITUTION: An X-Y table 9 is made to ascend higher than the level of conveyers 10 and 11 through a program so as to obtain a horizontal free movement. A soldering head 5 is made to move linearly as being guided by a horizontal beam 8 basing on a program and to stop at a position coincident with a fitted pattern of a printed board. A component chuck 6 is made to descend to position the tip of a lead 2a of an electronic component 2 on a pattern 12 of the printed board. The component 2 is kept as being held by the component chuck 6 of the head 5, a heating chip 7 descends on the lead 2a and executes reflow soldering as pressing against the lead 2a while a current is supplied to the heating chip 7. By this setup, the reduction of an operating time and manpower can be realized.