Title:
LEAD BLOCK FOR SURFACE PACKAGING HYBRID IC
Document Type and Number:
Japanese Patent JPH06163804
Kind Code:
A
Abstract:
PURPOSE: To increase the arrangement density of hybrid IC by enabling the hybrid ICs to be laminatedly arranged in the lead block for surface packaging hybrid IC.
CONSTITUTION: The lead block for surface packaging hybrid IC is provided with substrate inserting trenches 2 on one side as well as a multitude of through holes 3 with inner surface covered with conductive films 4 extending from upper surface to lower surface through the substrate inserting trenches 2.
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Inventors:
KOIKE SEIICHI
Application Number:
JP33799292A
Publication Date:
June 10, 1994
Filing Date:
November 25, 1992
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L25/00; H05K9/00; (IPC1-7): H01L25/00; H05K9/00
Attorney, Agent or Firm:
Hideaki Ogawa
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