Title:
LEAD FRAME AND CUTTING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3802820
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame which can be easily cut, and a cutting method therefor in cutting the lead frame by laser beam irradiation.
SOLUTION: A semiconductor chip is mounted on a lead frame formed by repeatedly arranging a plurality of combinations each consisting of at least a plurality of leads to be used as terminals of the individual semiconductor device and integrally molding the leads by a metal plate provided with a frame portion for a connecting the leads, the resulted product is sealed with a resin, and separated into individual semiconductor devices. In this case, the portion coated with Ag where the leads are to be cut is cut by irradiating the portion with a laser beam of 300 nm-320 nm in wavelength.
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| JPH07326704 | MOUNTING METHOD AND DEVICE OF LEAD FRAME SUBSTRATE |
Inventors:
Hitoshi Matsunaga
Application Number:
JP2002045861A
Publication Date:
July 26, 2006
Filing Date:
February 22, 2002
Export Citation:
Assignee:
New Japan Radio Co., Ltd.
International Classes:
H01L23/50; B23K26/18; B23K26/38; B23K101/38; (IPC1-7): H01L23/50; B23K26/00; B23K26/18; //B23K101:38
Domestic Patent References:
| JP2197373A | ||||
| JP11074435A | ||||
| JP2001085460A |
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