Title:
LEAD FRAME AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0582704
Kind Code:
A
Abstract:
PURPOSE: To provide a lead frame which is suitable to the formation of a semiconductor package which does not generate cracks when the semiconductor package is mounted.
CONSTITUTION: A lead frame 8 comprises a tab 5 and a lead 2. An acute angle- shaped projection 6 is formed on the end of a first main plane 9 of the tab 5 where a semiconductor device is installed. Moreover, there is installed a taper-shaped component 16 around the edge of a second main plane 2 on the opposite side of the first main plane 9 of the tab 5.
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Inventors:
FUJISAKI FUMITOSHI
Application Number:
JP23953491A
Publication Date:
April 02, 1993
Filing Date:
September 19, 1991
Export Citation:
Assignee:
FUJITSU LTD
KYUSHU FUJITSU ELECTRONIC
KYUSHU FUJITSU ELECTRONIC
International Classes:
H01L21/52; H01L23/28; H01L23/50; (IPC1-7): H01L21/52; H01L23/28; H01L23/50
Attorney, Agent or Firm:
Aoki Akira (4 outside)
Next Patent: LINEAR DISPLACEMENT DETECTION SENSOR