Title:
LEAD FRAME MANUFACTURING DEVICE UTILIZING LASER AND MANUFACTURE OF LEAD FRAME UTILIZING THE SAME
Document Type and Number:
Japanese Patent JPH10296464
Kind Code:
A
Abstract:
To provide a lead frame manufacturing device utilizing laser and a method of manufacturing lead frame utilizing the same.
The lead frame manufacturing device is equipped with a laser generator 100 arranged on the top, a laser irradiating route tube 102 mounted below the laser generator 100, a lead frame transfer component 106 placed under the laser irradiation route tube 102 and a laser absorption component 110 placed under the lead frame transfer component 106 and supporting the lead frame transfer component. Thereby, more exquisite work of pattern than in the conventional stamping work or etching is available.
Inventors:
HAN SUNG-YOUNG
Application Number:
JP10494098A
Publication Date:
November 10, 1998
Filing Date:
April 15, 1998
Export Citation:
Assignee:
SAMSUNG AEROSPACE IND
International Classes:
B23K37/00; B23K26/00; B23K26/066; H01L23/00; H01L23/495; H01L23/50; (IPC1-7): B23K26/00; B23K26/06; B23K37/00; H01L23/50
Attorney, Agent or Firm:
Youichi Oshima