PURPOSE: To prevent the generation of migration effect by die bonding part, to suppress an adverse effect inflicting on wire bondability by the out-gas generated from a bonding agent, and to improve the appearance by a method wherein an electronic circuit element mounting wiring substrate and the substrate supporting lead of a lead frame are connected without specially using a bonding agent and die-bonding paste.
CONSTITUTION: Through holes 6a are made in a semiconductor element mounting wiring substrate 6, and a substrate supporting lead 8, which supports the semiconductor element mounting wiring substrate 6, is formed on a lead frame member 11. After the tip of the inner edge part 8a of the substrate supporting lead 8 has been bent upward, the upwardly bent part of the inner edge part 8a is passed through the through hole 6a, and the semiconductor element mounting wiring substrate 6 is supported by the substrate supporting lead 8.
| JPH10247658 | MANUFACTURE OF SEMICONDUCTOR DEVICE |
| JP7161904 | Semiconductor device manufacturing method |
| JPH05114691 | LEAD FRAME |
TSUNODA TAKESHI
YAGI HIROSHI
